Product Profile of Industrial Die Bonding Machine

Industrial Die Bonding Machine can handle different types of endless Smart Card tapes and has ergonomically designed human machine interface. The Die Bonding Machine can handle 6" to 12" [300 mm] wafers and guarantees repeatable constant die bonding quality, independent of the user. The Die Bonding Machine is a compact in-line curing oven that guarantees best performance due to individual heating zones. Industrial Die Bonding Machine is an ultra fast vision system with enhanced pick and place with its innovative constant force bond head offer an incredible increase in performance, product quality.

Applications of Industrial Die Bonding Machine:

• Contact and contact less ID cards

• Banking cards

• GSM cards

• Any other type of Smart Cards




Key Features of Industrial Die Bonding Machine

• Handle different types of endless Smart Card tapes
• Ergonomically designed human machine interface
• Compact in-line curing oven guarantee best performance due to individual heating zones
• Ultra fast vision system with enhanced pick and place
• Constant Force Bond Head offer an incredible increase in performance, product quality